| 학회 |
한국공업화학회 |
| 학술대회 |
2017년 봄 (05/10 ~ 05/12, 광주 김대중컨벤센센터(Kimdaejung Convention Center)) |
| 권호 |
21권 1호 |
| 발표분야 |
접착제도료잉크 |
| 제목 |
Cure kinetics modeling of a solvent free epoxy coating and its application in shipyard. |
| 초록 |
This paper studies cure kinetics of conventional marine solvent free epoxy coating based on two components and determines a criteria of degree of cure for hard dry using differential scanning calrorimetry (DSC). This research provides a cure kinetic model which can quantify the degree of cure by determining the Arrhenius constans of the materials. The developed model was validated under constant and a set of cyclic heating conditions and has achieved a correlation coefficient of 0.98. This empirical model can predict the degree of cure over the temperature-time profile of the coating during non-isothermal heating. The temperature profiles of the structure can be obtained by real-time measurements and heat transfer simulations such as computational fluid dynamics (CFD). It provides a methodology which could be used for the heating system control of solvent free epoxy coatings in shipyards. |
| 저자 |
이민정, 박현
|
| 소속 |
부산대 |
| 키워드 |
cure kinetics; epoxy; solvent free; shipyard
|
| E-Mail |
|
