| 학회 | 한국화학공학회 |
| 학술대회 | 2022년 봄 (04/20 ~ 04/23, 제주국제컨벤션센터) |
| 권호 | 28권 1호, p.1041 |
| 발표분야 | [주제 12] 화학공학일반(부문위원회 발표) |
| 제목 | Nanoscale Dewetting Based Direct Interconnection for Assembly of Microscale Electronics |
| 초록 | The evolution of electronic devices has shown unprecedented progress. Electronic devices will become smaller in the future for multifunctionality, high performance, and power saving purposes, and will be densely integrated on limited areas. As electronic components become smaller at microscale, there are some limitations on integrating them by the general assembly methods, metal wiring, metal soldering, and anisotropic conductive film (ACF), like size limitation, throughput, poor mechanical stability and strong pressure and high heat for bonding. Here, we introduce a facile electrical interconnection method driven by selective dewetting of polymer adhesive that is applicable to a deterministic microelectronics assembly for flexible electronics. As the stability and interfacial potential of thin polymer adhesive depend on the materials of substrate and adhesive, and the thickness of adhesive, the wettability of polymer adhesive could be controlled by modulating the condition of the coated polymer adhesive, and the size of nanoparticles. The minimum feature size for assembling microdevices is 30 × 60 μm2 for microscale inorganic LEDs. |
| 저자 | 이주승, 김태일 |
| 소속 | 성균관대 |
| 키워드 | 재료(Materials) |
| 원문파일 | 초록 보기 |
