화학공학소재연구정보센터
학회 한국공업화학회
학술대회 2005년 가을 (10/28 ~ 10/29, 건국대학교)
권호 9권 2호
발표분야 전기화학
제목 Study on Characteristics of Electroless Copper Plating by Supercritical Fluid
초록 Copper layer was plated on 100 um PET film as a substrate to enhance the electric properties for the material of electronic parts in a supercritical CO2 Plating System (SCPS). In SCPS, experiments were conducted in the range of 45~75℃ temperature, pH of 12.5, CuSO4•5H2O/NiSO4•6H2O=12.5 bath composition, SnCl2/PdCl2=16 activation composition, and the pressure of 7~17 Mpa, CO2/electrolyte (volume ratio) = 9 respectively. The optimized temperature on the copper plating was showed at about 45℃. The effect of pH, bath composition, reaction time on the copper plating in SCPS was investigated as well. The electric properties of Cu/PET film electroless plating technology in SCPS were higher than those in conventional method.
저자 이희대1, 강전언2, 김문선2, 김철경1
소속 1목원대, 2성균관대
키워드 electroless Cu plating; supercritical fluid
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