| 학회 | 한국공업화학회 |
| 학술대회 | 2019년 가을 (10/30 ~ 11/01, 제주국제컨벤션센터(ICC JEJU)) |
| 권호 | 23권 2호 |
| 발표분야 | 포스터_콜로이드·계면화학 |
| 제목 | Highly enhanced thermal conductivity in bridging particle added system |
| 초록 | Recently, due to high integration of electronic devices, heat generated in electronic devices has increased. Failure to properly dissipate the heat can cause problems, such as shortening the efficiency and lifetime of the device. Therefore, there is a growing interest and demand for high thermal conductivity materials capable of dissipating such heat well. These high thermal conductivity materials are usually made by mixing high thermal conductivity fillers with polymers which have low thermal conductivity but good processability. However, the low thermal conductivity polymer acts as a large resistance to heat transfer, so the thermal conductivity of the composite is much lower than that of the fillers. Here, we introduced the concept of bridging particles to create a direct heat path between the fillers. When the same amount of bridging particles were included in the composite, the thermal conductivity was calculated according to the presence or absence of the direct heat path. |
| 저자 | 문수민, 최시영 |
| 소속 | 한국과학기술원 |
| 키워드 | high thermal conductivity; suspension |
