| 학회 |
한국공업화학회 |
| 학술대회 |
2005년 봄 (05/13 ~ 05/14, 충남대학교) |
| 권호 |
9권 1호 |
| 발표분야 |
정밀화학 |
| 제목 |
Effect of Temperature on Characteristics of Conductive-Copper Film Plated on PET Substrate in Hull Cell Plating System |
| 초록 |
In this study, Copper film plated on PET was prepared in a hull cell plating system. In order to determine optimum temperature, it was investigated in the range of 45~75 ℃ temperature at pH 12, at bath composition CuSO4·5H2O/NiSO4·6H2O = 12.5, and in 10 min. Copper plating was performed repeatedly by an electrplating method on the copper film plated by an electroless plating method to obtain thicker copper layer for the electronic parts. Through these experiments, temperature was optimized as 60℃. The characteristics of a plated copper film was analyzed with surface roughness, hardness, thickness deviation, and crystal structure and so on. |
| 저자 |
강전언1, 김문선1, 류정1, 이희대2, 김철경2
|
| 소속 |
1성균관대, 2목원대 |
| 키워드 |
copper film; PET; plating; hull cell system
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| E-Mail |
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