| 학회 | 한국공업화학회 |
| 학술대회 | 2022년 봄 (05/11 ~ 05/13, 제주국제컨벤션센터(ICC JEJU)) |
| 권호 | 26권 1호 |
| 발표분야 | 포스터-고분자 |
| 제목 | Increased mechanical and thermal properties of polymer composites by enhancing compatibility at the filler interface |
| 초록 | hBN(hexagonal Boron Nitride) is a renowned ceramic material having excellent high thermal conductivity. Recently although a lot of efforts has been made in the field of electrically insulating and thermally conductive polymer composites, satisfactory results have not been achieved yet because of poor compatibility between polymer and filler. In this study, BN was activated by chemical treatments to form polar interaction or hydrogen bonding between filler-filler and filler-polymer matrix. This intimate connection might increase interfacial density resulting in reducing interfacial thermal resistance(Ri) by suppressing phonon scattering at the interface. Thermal conductivity of the composite was monitored by IR camera and more quantitatively by Laser Flash Analysis (LFA). And the mechanical properties of the composite was measured by UTM according to ASTM standards. The structure and composition of the composite was analyzed SEM, TEM, RAMAN and XPS. |
| 저자 | 박혁, 서영수 |
| 소속 | 세종대 |
| 키워드 | polymers; Interfacial thermal resistance |
