| 초록 |
Recently, as semiconductor manufacturing process is became a micronization so the process is getting complicated. FFKM(Perfluoroelastomer), that is used at the semiconductor process as seal, need to be beard at the tough condition. For next generation FFKM should be better performance with plasma and thermal resistance than current generation. To reinforce plasma and thermal resistance base on the morphology with carbon allotropes(SWCNT, MWCNT, Carbon black, Fullerene, Graphene) filler is the purpose of the research. Confirmed thermal resistance by compression set and plasma resistance with CVD equipment. Also confirmed characteristic of morphology per each filler with SEM and TGA. |
