| 초록 |
Researching the effect of a high heat density in electronic components is accelerating due to the increasing demand for the high integration of electronic materials. Therefore, it is necessary to develop a technology to overcome heat problems, because a high heat density decreases the efficiency of devices and deteriorates their reliability. In this research, the effect of the interface layer between the coating layer and substrate on the thermal properties was investigated by comparing predicted and measured results. As a substrate material, aluminum alloy (Al6061) was selected. Magnesium oxide (MgO) paste was used as a coating material. The coating layer on the substrate was processed by screen printing. Light flash analysis (LFA) was used for the measurement of the thermal diffusivity. Then, the measured thermal conductivity could be calculated by multiplying the thermal diffusivity, specific heat and density. The predicted thermal conductivity was calculated with the Ansys workbench 12.0.1 simulation program. In the simulation condition, it is assumed that the heat flow is steady-state and the MgO film is a poly crystal. For the accurate prediction of the thermal conductivity, we assumed that the existence of an interface with a thickness of 10 nm and thermal conductivity of 0.4 W/mK between the coating layer and substrate. The interface contributed to the accurate prediction of the thermal conductivity compared to the measured value. By controlling the heat flow and careful considering of the interface effect, the more precise prediction of the thermal conductivity for high heat density electronic components should be possible. |
