| 학회 |
한국공업화학회 |
| 학술대회 |
2022년 봄 (05/11 ~ 05/13, 제주국제컨벤션센터(ICC JEJU)) |
| 권호 |
26권 1호 |
| 발표분야 |
포스터-고분자 |
| 제목 |
Solvent-free encapsulation of curing agents for one-component epoxy adhesives |
| 초록 |
One-componentepoxy adhesives, in which the epoxy resin and curing agent are premixed, havemany commercial advantages including reduced working time and stableperformance. However, these adhesives suffer from a short shelf life even atroom temperature. Here, core-shell structured curing agents were prepared via adry particle coating(DPC) process that improved the storage stability ofone-component epoxy adhesives. The DPC process is a simple, economic, andsolvent-free method to fabricate core-shell structured materials usingmechanical forces. Graphene nanoplatelets(GNPs) were used as encapsulatingmaterials due to their high thermal conductivity and large surface areas. |
| 저자 |
지성민1, 안철희2, 박종혁1, 김태안1, 박민1
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| 소속 |
1한국과학기술(연), 2서울대 |
| 키워드 |
고분자; 복합소재; 에폭시; 접착제; 기계적강도; 보존안정성
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| E-Mail |
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