| 학회 |
한국고분자학회 |
| 학술대회 |
2014년 봄 (04/10 ~ 04/11, 대전 컨벤션센터) |
| 권호 |
39권 1호 |
| 발표분야 |
고분자가공/복합재료- 미래 자동차용 고분자소재 최신기술 동향 |
| 제목 |
Thermal Conductivity and Adhesion Strength of Boron Nitride Contained Pressure-Sensitive Adhesives |
| 초록 |
Thermal conductivity and adhesion strength of UV cured acrylic adhesives with boron nitride and other fillers were investigated. Thermal conductivities and adhesion strength were measured using a heat-guarded method and 90° peel test, respectively. The thermal conductivity of the boron nitride contained adhesives was higher than that of Al2O3 contained one. The thermal conductivity of BN contained, 10 wt%, acrylic adhesives was 0.24 W/mK, whereas that of neat acrylic adhesives was 0.16 W/m∙K. In addition, synergistic effect on thermal conductivity was observed for (BN+Carbon Fiber) contained adhesives. |
| 저자 |
박규대1, 고영희1, 송예슬1, 이주원2, 김성룡1
|
| 소속 |
1한국교통대, 2미래나노텍 |
| 키워드 |
adhesive; thermal conductivity
|
| E-Mail |
|
