| 초록 |
Failure of electrical and electronic products has various causes. But over than 55% of defects are caused by heat. Thus, thermal management is the challenge faced by researchers because of high energy consuming density. The heat generated inside of devices can degrade or destroy its functionality. To prevent that from happening, this heat must be removed from the device as quickly as possible. But, usually, adhesive is a major hindrance to efficient heat transfer. Therefore, developing adhesive which can maximize thermal transfer is becoming a key issue. Thermal and adhesive properties of PSA with SWCNT and PCM were evaluated. As PCM contents increased, temperature change was reduced. In case of CNT, thermal conductivity of PSA was increased. The thermal fillers, PCM and CNT can attribute to thermal management. |
