| 초록 |
The innovation of Light Emitting Diode (LED) marks a real breakthrough in the lighting industry. Recently a lot of studied has been made to develop LED encapsulation materials. Encapsulation materials need to be optically clear and resistant to photochemical/thermal degradation. Since silicon materials are of thermal stability, it would be suitable for LED encapsulation applications. In particular, polyhedral oligomeric silsesquioxanes (POSS) have excellent thermal stability due to their high glass transition and decomposition temperatures. In addition, it is expected that incorporating POSS units has been known to increase mechanical properties of siloxanes polymers. In this study, we prepared POSS-containing LED encapsulation materials. Several approaches were made either to decorate POSS with oligomeric siloxanes having reactive functional groups or to prepare POSS/siloxanes copolymers. |
