| 학회 | 한국고분자학회 |
| 학술대회 | 2005년 봄 (04/14 ~ 04/15, 전경련회관) |
| 권호 | 30권 1호, p.359 |
| 발표분야 | 고분자 구조 및 물성 |
| 제목 | Surface and Thermo-mechanical Properties of Polyimide Hybrid Films |
| 초록 | In FCCL (flexible copper clad laminate) preparation process, the interfacial relationship between polyimide film and copper foil is very important. Specially, the relationship of their discrepancy of CTE (coefficient of thermal expansion) and adhesive property between two faces are the serious problem in process FCCL. In this study, we prepared polyimide hybrid film via sol-gel process, inorganic material dispersed on polyimide matrix within nanoscale, and so roughness made on film surface (Figure1). It brought to improve adhesion property that unevenness rose on surface of film. Also, mechanical properties improve additionally. In result, tensile strength improved about 30%, and elongation improved 2.4 times as increase content of TMOS. We ascertained formation of SiO2 by FT-IR spectrum, quantity of SiO2 in matrix estimated by TGA thermogram. Surface roughness of hybrid film increased as increased content of TMOS. We confirmed that silica particle uniformly dispersed in surface of hybrid film by SEM and AFM photography. (a) PI 100% (b) PI/TMOS 5wt% Figure 1. AFM photograpy of polyimide hybrid films. |
| 저자 | 설경일1, 서관식1, 김용석1, 최길영1, 김용원2, 원종찬1 |
| 소속 | 1한국화학(연), 2SKC |
| 키워드 | hybrid; polyimide; sol-gel; adhesive properties |
