| 초록 |
We fabricated foldable OFET on paper substrate. Until now, people thought that organic semiconductor had seemed as being promising replacement using their good mechanical properties and compatible with plastic substrate. However, over some degrees strain, although polymer dielectric and organic semiconductor were used, OFET usually couldn’t resist high mechanical stress. To solve these critical problems, we constructed devices by using electrospun poly(3-hexythiophene) fibers as semiconductor layer and PEGDA-ion mixed UV crosslinked gel as dielectric layer. Consequently, P3HT fibers based device showed high performance as high mobility (1~4 cm2/Vs) and on-off ratio (approximately 104~105). Furthermore, by fabricating device structure using electrospun fibers and gel type, device could successfully resisted under high strain (ε=37%). |
