학회 | 한국고분자학회 |
학술대회 | 2003년 가을 (10/10 ~ 10/11, 부경대학교) |
권호 | 28권 2호, p.35 |
발표분야 | 특별 심포지엄 |
제목 | Polymer Adhesive-Based Planar Optical Packaging and Reliability |
초록 | Packaging of an optical device is a major factor to determine the device reliability and manufacturing cost.1 Planar optical devices such as PLC (Planar Lightwave Circuits) type devices have been known to be a promising solution for cost reduction and good environmental reliability due to the mass-producible, precious and solid-state planar chip fabrication compatible to the conventional semiconductor fabrication process.2 However, packaging issues to PLC devices have not been well known to the public, although the fabrication of PLC chip has been very well realized. Since a multi-channel-count device has been demanded from the market, polymer adhesives have been widely used to meet the planar packaging requirements due to easy alignment capability.3 Also, polymer adhesives are the important part of plastic optical packaging, a newly developed concept of optical packaging technology, to secure optical interconnection. However, a poor reliability reputation of polymer adhesives in harsh environment has been a bottleneck to meet the device reliability requirements.4 In this presentation, the evaluations and reliability issues of polymer adhesive-based planar optical packaging technology are introduced. References 1. P. O. Haugajaa, “Packaging of Optoelectronics Components,” Short Course Notes, OFC ’97, Dallas, TX, 1997. 2. Y. Hibino, F. Hanawa, H. Nakagome, M. Ishii and N. Takato, “High Reliability Optical Splitters Composed of Silica-Based Planar Lightwave Circuits,” J. Lightwave Technol., vol. 13, p.1728, 1995. 3. N. Murata, “Adhesives for Optical Devices,” Proc. 48th Electronic Components and Technology Conference, Seattle, WA, p.1178, 1998. 4. A. Piccirillo, G. Zaffiro, T. Tambosso and G. Gallo, “Reliability of Optical Branching Devices,” IEEE J. Sel. Topics Quantum Electron., vol. 5, p.1413, 1999. |
저자 | 김태훈, 유병권, 이태형 |
소속 | 포인테크 (POINTek Inc.) |
키워드 | Polymer Adhesive; Planar Optical Packaging; Reliability; Planar Lightwave Circuits |