| 초록 |
Patterning technology has played a dominant role in the growth of the semiconductor business and determined the design rule of circuits in devices. Optical lithographic method has been used to realize circuit image in wafers over 20 years due to its productivity as well as preciseness. Wafer went in with a uniform photoresist coating and came out with minutes, but recongnizable, circuit patterns. Though advanced fabrication methods build far more complex circuits using far more sophisticated equipment, the photosensitive polymer remains a critical bridge between the abstract design and the physical circuit. The exposure system manipulates photons, assembling them into an aerial image at the wafer plane, it is the photoresist that gives the aerial image tangible reality. In this talk, recent lithographic method such as immersion lithography for line & space patterns and chemical attachment process for contact hole pattern will be introduced and each process issues will be discussed. |
