| 초록 |
Polyimides have been applied in engineering fields such as aerospace, electronics, and other industries because of their excellent thermal, mechanical properties, high glass transition temperature, and good chemical resistance. However, polyimide films are generally prepared in two steps by the manufacture of poly(amic acid) precursor using organic solvents and imidization of poly(amic acid). This conventional method use the organic solvents such as dimethylformamide (DMF), N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidone (NMP), and m-cresol, which are hazardous to the environment. In addition, organic catalysts or long and complex temperature conditions require in imidization step of poly(amic acid). In this study, we prepared polyimide films through the comparatively environmentally benign synthesis method using the water-containing solvent mixture. |
