초록 |
We investigated an electrolytic and electroless aluminum plating based on both 1-Ethyl-3-methylimidazolium chloride and diglymes. In each medium, we compared the surface morphology and crosssectional structures formed at different electroplating and electroless conditions, which should affect the stability of Al deposits. In the case of electrolytic Al plating, it was revealed that the combination of Al electroplating condition and post-treatment is essential to get smooth and compact Al layers. In the meanwhile, electroless plating was performed using diisobutyl aluminum hydride (DIBAH) as reducing agent in the ionic liquid. The plating film was analyzed by measurements of X-ray diffraction, scanning electron microscopy with energy-dispersive X-ray analysis (SEM-EDX). |