| 학회 | 한국재료학회 |
| 학술대회 | 2005년 가을 (11/10 ~ 11/11, 한양대학교) |
| 권호 | 11권 2호 |
| 발표분야 | 반도체재료 |
| 제목 | 핫엠보싱 공정을 위한 플라스틱 몰드 제작 |
| 초록 | 1. INTRODUCTION Nanoimprinting lithography (NIL) is known as a technique for the generation of high definition nano and micrometer scale patterns. Nano and micro pattern processes are very necessary for the fabrication of commercial products such as micro-fluidics, bio-devices, flexible display and MEMS structures. NIL needs a mold to form patterns on a substrate. Conventional mold materials are fabricated by silicon, quartz, and metal. Silicon and quartz molds are easy to break. Metal molds are cost intensive and take a long time to fabricate. Alternatively, plastic molds are robust enough to imprint and inexpensive. In this paper, we fabricated plastic mold using PC(poly -carbonate) wafers and imprinted to PMMA substrate by hot embossing process. 2. EXPERIMENTAL RESULTS AZ1518 PR(Clariant, USA) was spin-coated on a 500 nm thick 4 inch oxide wafer to have 1.5 µm thickness. Coated wafer was going on a photolithography process using a chrome mask which had 4 µm pattern width. After developing, patterned oxide wafer was dry etched using an oxide etcher(AOE, STS, England). Residual AZ1518 was removed by PR remover(Kwik Strip®, Clariant, USA). Prepared oxide wafer mold was deposited an antistiction layer using a home-made type PECVD(plasma enhanced chemical vapor deposition). PC wafer was imprinted by the oxide wafer mold using EVG520HE (EVG, Austria). |
| 저자 | 박창화1, 임현우2, 차남구3, 박진구3, 서지훈4 |
| 소속 | 1한양대 마이크로바이오칩센터 / 한양대 금속재료공학과, 2한양대 마이크로바이오칩센터, 3한양대 금속재료공학과, 4올메디쿠스 |
| 키워드 | hot embossing; NIL; antistiction layer; plastic |
