| 초록 |
The curing behavior and thermal conductivity(TC) of synthesized diglycidyl ether of 4,4′-biphenol(DGEBP) was compared to commercial product of 4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl(YX 4000H). The synthesized DGEBP epoxy shows the higher TC due to the pi-pi stacking of mesogen groups. The curing behavior of various resin systems was analyzed by isothermal experiments using differential scanning calorimeter(DSC) without any addition of conductive fillers. The TC of epoxy/carbon nano plate(CNP) composites were conducted as a function of CNP content by means of laser flash method. The amphiphilic ionic diblock copolymer was synthesized as a compatibilizer for high dispersion of CNP in epoxy matrix. The compatibilizer was functionalized noncovalently at CNP surface by pi-pi interaction between pyrene group in compatibilizer and CNP surface. The TC of surface functionalized CNP filled epoxy composites were increased due to the high dispersion state of CNPs in polymer matrix. |
