| 학회 |
한국고분자학회 |
| 학술대회 |
2011년 봄 (04/07 ~ 04/08, 대전컨벤션센터) |
| 권호 |
36권 1호 |
| 발표분야 |
고분자가공/복합재료 |
| 제목 |
Effect of structure of biphenyl type epoxy with curing agent and curing condition on suppressing Cu migration |
| 초록 |
The changing of the free volume in biphenyl type epoxy with surfactant and pre-curing temperatures was studied. Free volume was calculated with coefficient of thermal expansion (CTE) measured by thermo-mechanical analysis (TMA). Curing schedules are determined by differential scanning calorimeter (DSC). Polycrystalline structure of epoxy is characterized by electron diffraction. Moisture absorption test of biphenyl type epoxy is measured by humidity chamber. Cu migration is observed by optical microscope (OM) and scanning electron microscope (SEM). Free volume of epoxy is discussed in terms of the pre-curing temperature applied to the epoxy systems, their characteristic glass transition temperatures and their crosslink density. The packing of the molecular chains of the epoxy network is governed by pre-curing temperature and different type hardener. Because biphenyl type epoxy is good crystallinity, moisture absorption is low then Cu migration is suppressed. |
| 저자 |
최민우1, 이규원2, 윤호규1
|
| 소속 |
1고려대, 2하이닉스 반도체 |
| 키워드 |
TMA; Cu migration; moisture absorption
|
| E-Mail |
|
