| 학회 |
한국고분자학회 |
| 학술대회 |
2020년 가을 (10/05 ~ 10/08, 부산컨벤션센터(BEXCO)) |
| 권호 |
45권 1호 |
| 발표분야 |
기능성 고분자 |
| 제목 |
Synthesis and preparation of low dielectric Polyimide having excellent adhesion property |
| 초록 |
Due to the development of 5G communication, the amount of data transmission is needed and high frequency band is used. To reduce signal loss, Dielectric substrate should be required having low-dielectric and low-dielectric loss property. In this study, we designed new polyimide structure. The long aliphatic diamine was used to increase free volume, and cross-linking moiety was introduced to reduce the polarization. This leads to low dielectric and low dielectric loss. Polyimide as well as copper foil are used for 5G communication. The low-roughness copper foil used as a 5G communication has a problem of low adhesion to polyimide. Therefore, alkoxy silane compound was introduced to improve adhesion. We can obtained polyimide having a dielectric constant of 2.6 or less at 1 GHz and adhesive strength 1000gf/cm or more. |
| 저자 |
이지원1, 박노균2, 김현철1, 김윤호1, 고민재1, 최성룡2, 원종찬3
|
| 소속 |
1한국화학(연), 2한양대, 3ABC나노텍 |
| 키워드 |
Polyimide; low dielectric Polyimide; alkoxy silane; adhesion; 5G communication
|
| E-Mail |
|
