| 초록 |
Synthesized soluble polyimide was further crosslinked with a (hydroxymethyl)benzoguanamine (HMBG) as cross-linking agent at very low temperature (160 oC). Thin film properties of a new low temperature crosslinked polyimide were systematically characterized such as chemical structures, surface properties, thermal stability, and capacitance, etc. A crosslinked DOCDA-6FHAB film showed low leakages current density in metal-insulator-metal devices. The leakage current density and breakdown voltage of a crosslinked DOCDA-6FHAB were found to be less than 9.1x10-10 A/cm2 at 1 MV/cm and above 3 MV/cm. We have fabricated TFT using crosslinked DOCDA-6FHAB with HMBG as a gate dielectric with bottom gate-top contact configuration (channel length L = 100 µm and width W = 1500 µm). TFT showed field effect mobility as 0.205 cm2/Vs and did not show any hysteresis during forward and reverse gate voltage sweep between -30 V and +10 V. |
