| 초록 |
The high coefficient of thermal expansion (CTE) of the epoxy composite frequently causes the CTE-mismatch problem in semiconductor packaging. However, when the epoxy resins available currently are used for composite, the CTE-mismatch problem is inevitable even at the highly-filled conditions. In this study, the new type of bisphenol A (BPA) epoxy resin, i.e., ethoxysilyl-functionalized BPA epoxy was synthesized for the ultra-low CTE epoxy composite. The new epoxy composite with 85wt% of silica content showed the ultra-low CTE of 3.2 ppm/℃ and 6.0 ppm/℃ at the temperature ranges of T |
