| 초록 |
In this study, Cu/PET film composites were prepared by electroless and electro copper-plating methods in a hull cell plating system. In order to determine optimum plating conditions, it was compared the effect of bath temperature 40~80 ℃, pH 7~12, bath composition Cu2+/Ni2+ =10~16 and plating time 3~30 min on the plating characteristics. And then, copper plating was performed on the copper film immobilized by an electroless plating method to obtain the copper/PET film for the electronic parts. Through the experiments by copper plating method, the optimum temperature was 60℃, the optimum pH was 9, the optimum bath composition was Cu2+/Ni2+ = 12.5 and the optimum plating time was 10 min. The characteristics of a plated copper film was analyzed with surface roughness, hardness, thickness deviation, and crystal structure and so on. |
