| 학회 | 한국화학공학회 |
| 학술대회 | 2006년 봄 (04/20 ~ 04/21, 대구 인터불고 호텔) |
| 권호 | 12권 1호, p.52 |
| 발표분야 | 공업화학 |
| 제목 | Preparation of Conductive PET Film for Electronic Parts in Copper Plating Solution Containing Supercritical CO2 |
| 초록 | In this study, the conductive PET film by using of eletroless plating in a copper plating solution containg supercritical CO2 was prepared. The plating conditions were as follows. The concentration of compositions as CuSO4•5H2O, NiSO4•6H2O, SnCl2, and PdCl2 is 0.025 M, 0.002 M, 0.16 M, and 0.01M, respectively at 7~17 Mpa and at pH 12. The concentration ratio of CO2/electrolyte, pressure, temperature had an effect on dispersion property of a copper plating solution. To understand the effect of an increasing electrolyte concentration on a plating characteristics, a volume rate of CO2/electrolyte was changed form 5 to 10. The copper plating was performed at 45~50℃. The copper PET film by a electroless plating was analyzed with surface roughness, conductivity, and light transmitivity and so on. |
| 저자 | 이희대1, 김남기1, 김철경2, 윤상호2, 김문선1 |
| 소속 | 1성균관대, 2목원대 |
| 키워드 | Supercritical CO2; Copper Plating; PET Film |
| 원문파일 | 초록 보기 |
