| 학회 |
한국재료학회 |
| 학술대회 |
2009년 가을 (11/05 ~ 11/06, 포항공과대학교) |
| 권호 |
15권 2호 |
| 발표분야 |
B. Nanomaterilas Technology(나노소재 기술) |
| 제목 |
Low Temperature Plasma-Enhanced Atomic Layer Deposition Cobalt |
| 초록 |
Cobalt thin film was fabricated by a novel NH3-based plasma-enhanced atomic layer deposition (PE-ALD) using Co(CpAMD) precursor and NH3 plasma. The PE-ALD Co thin films were produced well on both thermally grown oxide (100 nm) SiO2 and Si(001) substrates. Chemical bonding states and compositions of PE-ALD Co films were analyzed by XPS and discussed in terms of resistivity and impurity level. Especially, we successfully developed PE-ALD Co deposition at very low growth temperature condition as low as Ts = 100 °C, which enabled the fabrication of Co patterns through lift-off method after the deposition on PR patterned substrate without any thermal degradation. |
| 저자 |
김재민, 김형준
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| 소속 |
연세대 |
| 키워드 |
원자층 박막 증착법 (Atomic layer deposition); 코발트 (cobalt); 리프트오프 패터닝 (Lift-off Patterning)
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| E-Mail |
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