| 초록 |
Looking inside the package, there were materials such as silicon chips and epoxy resin that had large differences in CTE. Thus, problems arised due to CTE-mismatch between materials at high temperatures. Thermal stress occured in the interface between materials, resulting in surface crack or bending. Therefore, epoxy materials with a lower thermal expansion were required. In addition, the crack should be suppressed as much as possible through low young’s modulus. By adding silica and random copolymer to the biphenyl-based epoxy system, the warpage phenomenon could be minimized. The analysis was conducted using UTM, DMA, TMA and DEA equipment to understand the thermal, mechanical and electrical properties of these epoxy composite materials. This allowed the creation of epoxy composite materials with Low modulus and Low CTE properties. |
