| 초록 |
Electrodeposition has been attracting attentions because of its many advantages including low-cost, rapid deposition rate, and ease of control their microstructure and crystallinity by adjusting electrodeposition parameters. Among many applications, electrochemical deposition techniques can be used for the thermal management. Firstly, for active cooing system, thermoelectric materials/modules have great attraction recently. Thermoelectric compounds such as Sb2Te3, Bi2Te3, and Bi2Se3 have been extensively studied because of their potential applicability for efficient energy harvesting and cooling devices. We synthesized nano-dots/phases embedded thermoelectric materials by electrochemical process, resulting that the power factor was 70 % thermoelectric performance compared to the bulk counterpart. Secondly, for passive cooling methods, insulating substrates with high thermal conductivity can meet the demand for high power LED devices instead of using printed circuit boards. Direct plating method on insulating substrates is the scalable one with low cost and simple process. However, poor adhesion of plated metal electrodes limits the real application without using other process such as vacuum process and annealing process. The detailed results will be presented. |
