| 학회 |
한국고분자학회 |
| 학술대회 |
2007년 봄 (04/12 ~ 04/13, 제주 ICC) |
| 권호 |
32권 1호 |
| 발표분야 |
고분자 계면 및 표면 |
| 제목 |
Surface Modification of Polyimide Film by a Wet Treatment for Copper Metallization on Microelectronic Flexible Substrate |
| 초록 |
Polyimide (PI) films have been known as a high-performance material being widely applicable to microelectronic industry. Copper is one of representative coating metals in the field of flexible printed circuit boards because of its excellent conductivity and relative low electromigration property. It has been mostly coated to a substrate by physical deposition techniques, such as vacuum evaporation, sputtering, and electro plating. However, the satisfactory adhesion strength of copper metals to PI films could not be obtained in these processes. On the scope of industrial applications, surface modification of PI films by wet treatment were considered to improve the adhesion strength of copper metal layer to PI film. In this study, the influence of surface modification of PI films on the adhesion property were investigated by various analytic methods |
| 저자 |
박윤준1, 김화진1, 최준규1, 김석제1, 안정호2, 홍영택1
|
| 소속 |
1한국화학(연), 2성균관대 |
| 키워드 |
polyimide film; surface modification; adhesion property
|
| E-Mail |
|
