| 초록 |
Gold patterns were prepared via microcontact printing (MCP) of 3-aminopropylethoxysilane (γ-APS) on plasma etched polyimide coating, followed by layer-by-layer (LBL) deposition of gold nanoparticles (GNPs), O2 plasma etching and then sintering. First, the polyimide coating on silicon wafer was modified via water plasma etching, followed by MCP of γ-APS with a patterned polydimethylsiloxane (PDMS) stamp. Then, the multilayer of GNPs (d=2~3 nm) was formed on the γ-APS patterns via LBL deposition of citrate capped GNPs and poly(ethyleneimine) (PEI). Thirdly, O2 plasma etching to remove PEI and then sintering was carried out to afford metallic gold patterns. Finally, the patterned GNP multilayer characterized by TGA, Uv-vis/near-IR spectroscopy, atomic force microscopy (AFM), optical microscopy (OM) and electrical conductivity measurement via 2-point probe method, exhibiting nice gold patterns of 20-layer GNP with electrical conductivity of 4x104 Ω-1cm-1. |
