| 학회 |
한국고분자학회 |
| 학술대회 |
2015년 봄 (04/08 ~ 04/10, 대전컨벤션센터) |
| 권호 |
40권 1호 |
| 발표분야 |
고분자가공/복합재료 |
| 제목 |
Thermal conductivity improvement of UV-polymerized pressure sensitive adhesives using expanded graphite intercalated compound |
| 초록 |
The expanded graphite intercalation compound (xGIC) was used as a thermally conductive fillers in pressure sensitive adhesives (PSAs). The effects of xGIC filler on the morphology and thermal conductivity of PSA were investigated. The point of filler input was changed and its effect on the thermal conductivity was investigated. The 2-dimensional xGICs were uniformly dispersed in acrylic based matrix and the degree of filler connection increased with increasing filler content. The adhesion strength and tack property of UV-polymeried PSAs were strongly dependent on amount of the filler content and the point of filler input. The thermal conductivity of PSAs was explained in terms of filler dispersion, degree of polymerization, and matrix infiltration. The thermal conductivity of PSA increased more than 200% by adding 20 wt% of xGIC compared to that of the unfilled PSA. |
| 저자 |
박규대1, 송예슬1, 이희진1, 이주원2, 이성구1, 김성룡1
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| 소속 |
1한국교통대, 2미래나노텍 |
| 키워드 |
Thermal conductivity; adhesive; graphite intercalated compound; UV polymerization
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| E-Mail |
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