| 초록 |
Silicone encapsulants are designed to meet the challenging needs of the LED market, indcluding high adhesion, high purity, moisture resistance, thermal stability, and optical transmittance. Silicone materials can absorb stresses caused by thermal cycling inside the LED package, protecting the chip and the bonding wires. In this project, we research various raw materials such as silicone polymer, resin and crosslinker. We formulate and test various reliability properties such as light characteristic, thermal shock, MSL(moisture sensitive level), gas barrier property and obtain good results. The several results will be discussed. Finally, we speak that this project accomplished by national project funds. |
