| 초록 |
With the huge development of 5G communication technologies, the importance of developing low dielectric loss materials for flexible copper clad laminates (FCCL) has been rapidly increased. Combination of polyimide (PI) film and commercially available bonding sheet for 5G FCCL substrate has a problem of relatively high dielectric loss. To replace them, poly(glycidyl methacrylate) grafted Poly(ether ether ketone) (PEEK-g-PGMA) was prepared via self UV-initiated surface modification, and copper film was adhered by hot press. The appearance and mechanical properties were maintained after the UV grafting process, and thin PGMA layer was identified by FT-IR and XPS spectra, contact angle hysteresis. Peel strength was measured by 90º peel test with different variations, and dielectric properties were measured at 28 GHz frequency. The results show the successful preparation of PEEK-g-PGMA film, and the substitutability of PEEK film as a bonding sheet-less 5G FCCL substrate. |
