| 초록 |
The heat resistance of polymer is closely related to chemical structures, and they have brittle properties depending on the degree of rigidity of the structure, which has an effect on reducing mechanical properties. Heat resistance characteristics of polymers are shown in the order of PBI ＞ PBO ＞ PI. In order to give higher heat resistance properties than existing polyimide (PI) and to increase mechanical strength, benzoxazole unit was introduced into a new monomer and studied. It uses 2,2-Bis(3-amino-4-hydroxylphenyl)propane and 4-nitrobenzoyl chloride to synthesize diamine Bis-PBDA with 3-step synthesis. After synthesizing poly(amic acid) (PAA) using synthesized Bis-PBDA and four different dianhydrides, a polyimide film with benzoxazole monomers was obtained through thermal imidization. Imidization was confirmed through FTIR and thermal and mechanical properties were analyzed through TGA and UTM. |
