| 학회 |
한국고분자학회 |
| 학술대회 |
2012년 봄 (04/12 ~ 04/13, 대전컨벤션센터) |
| 권호 |
37권 1호 |
| 발표분야 |
분자전자 부문위원회 |
| 제목 |
The design and preparation of novel low-CTE epoxy composites for semiconductor packaging |
| 초록 |
As the electronic packaging becomes smaller, thinner and more complicated, the control of thermal expansion of polymeric materials become more and more critical issues to be solved. Thus, in this work, the studies on the design and the preparation of low-CTE epoxy composite systems were carried out. Here, a series of epoxy resins for low-CTE glass fiber composites were synthesized and cured with phenol novolac as well as aromatic amine. Their composites were prepared using the E-glass fiber and the thermal properties of these composites were evaluated by thermomechanical analyzer (TMA). All of these composites showed the excellent CTE (α1) of ＜ 10 ppm/℃ at the 40 wt% of binder in formulation. The best composite obtained from this study show the excellent thermal property such as CTE ~7ppm/℃ and Tg ＞ 250℃. |
| 저자 |
전현애, 탁상용, 박수진, 김윤주, 강경남, 박숙연
|
| 소속 |
한국생산기술(연) |
| 키워드 |
epoxy composite; thermal property; CTE; Tg; semiconductor packaging
|
| E-Mail |
|
