| 학회 |
한국재료학회 |
| 학술대회 |
2019년 봄 (05/15 ~ 05/17, 평창 알펜시아 리조트) |
| 권호 |
25권 1호 |
| 발표분야 |
D. 구조 재료 분과 |
| 제목 |
All inkjet printed highly packed Al2O3-resin hybrid film for heat dissipation substrate |
| 초록 |
Recently, heat dissipation materials with good insulation and high thermal conductivity have drawn a lot of attention because heat dissipation materials are important to reduce the thermal degradation of lifetime and reliability of devices. Ceramic materials such as AlN, Al2O3, BN have considered as a thermally conductive material due to their high thermal conductivity and insulating properties. The thermal conductivity of ceramics is affected by packing density, particle size and size distribution, processing method and so on. In this work, we fabricated Al2O3-resin hybrid film which can effectively transfer the heat of the device to the heat sink by inkjet printing. The thermal properties of Al2O3-resin hybrid films were measured by thermal resistance measurement, and the insulation properties were measured by I-V curves. Heat flux is affected by the thermal conductivity and the thickness of the film. The Al2O3-resin hybrid film exhibits improved heat flux because the film is 10 times thinner than the conventional Al2O3 heat-dissipating substrate. Acknowledgement This research was financially supported by the Ministry of Trade, Industry and Energy(MOTIE) and Korea Institute for Advancement of Technology(KIAT) through the International Cooperative R&D program(P0006844_Development of color conversion nanocrystal luminescence materials for next generation display). |
| 저자 |
김현빈1, 정성국2, 정동인3, 최승희4, 권석빈5, 유정현1, 윤대호2
|
| 소속 |
1School of Advanced Materials Science and Engineering, 2Sungkyunkwan Univ. (SKKU), 3Suwon, 4440-746, 5Republic of Korea |
| 키워드 |
Al2O3; resin; Hybrid film; Inkjet printing
|
| E-Mail |
|
