| 학회 | 한국재료학회 |
| 학술대회 | 2021년 가을 (11/24 ~ 11/26, 경주 라한호텔) |
| 권호 | 27권 2호 |
| 발표분야 | G. 나노/박막 재료 분과 |
| 제목 | Development of ultra-thin electrode fabrication through Ag nanoplate and chemical sintering |
| 초록 | Recently, as the demand for bendable or foldable electronic devices increases, it is necessary to develop suitable electrode materials and printing processes. Due to the conductivity and flexibility in network form, high aspect ratio of metal nanoplate is regarded as candidates for flexible electrode fabrication. Flexible substrates such as plastics, polymers, and paper have high thermal sensitivity, making it difficult to apply conventional thermal sintering, so methods such as chemical sintering have been proposed. In this paper, a single-step Ag hexagonal nanoplate synthesis process and a simple 70nm-thick ultrathin electrode fabrication process with chemical sintering were presented. We also proposed electrospray deposition for fast electrode patterning. For synthesis, nanoplates are formed while maintaining a low reduction rate through NMP as a solvent and PVP as a surfactant induces nuclear growth in the (111) plane. Kinetically controlled synthesis was successfully employed to produce high aspect ratio Ag nanoplates with a width of about 100 nm and a thickness of 20 nm. Ag nanoplates were tiled through spin coating to form an ultra-thin film with a thickness of 70 nm. The conductivity is 35 ohm/cm, demonstrating the potential for electrode formation through chemical sintering. The thickness and coverage of the electrodes were confirmed through SEM image analysis, and electrical conductivity was analyzed through the I-V curve measured with the probe station. |
| 저자 | 장현배, 권도균 |
| 소속 | 한국항공대 |
| 키워드 | Ultrathin electrode; Flexible electrode; Ag nanoplate; ESD; chemical sintering process |
