| 초록 |
Polyimide (PI) is an attractive organic material satisfying the utmost properties required in recent development for highly functional materials due to its excellent thermal, chemical, and mechanical stability and electrical properties. PI has been widely used as coating materials for microelectronic application, such as flexible printed circuits, tape automated bonding, interlayer dielectrics, and buffer coatings in electronic packages. In this presentation, a facile method for polyimide (PI) coating with enhanced hydrophobicity through the deposition of morphology controlled PI particles is discussed. An electrospraying process combined with in situ imidization was employed in the fabrication of the PI particles for controllable morphologies as well as hydrophobic multilayered films. We confirmed that in situ imidization accompanying evaporation of the solvent affected the surface morphology of the PI particles during the reactive electrospraying process. |
