| 초록 |
Recently, commercial dielectric materials, such as epoxy and BT, have some limitations to use high frequency parts, so many people take interest in Liquid Crystalline Polymers(LCPs) as dielectric material for Printed Wiring Board. Because. Moreover LCPs have lower thermal expansion than commercial dielectric materials. Despite of these advantages, LCPs have not been wildly used yet due to reliability performance, processing and cost. In this study, we developed glass reinforced LCPs covered with epoxy film which we make for high reliability. We report on the changes of mechanical and Thermal properties as glass type, resin content and epoxy films. |
