| 초록 |
Recently, there are many researches on developing novel materials that have low thermal expansion, high dielectric, and good mechanical properties. This is because IT industries require high performance materials to support the miniaturization of components. In this study, we modified glass fiber reinforced epoxy composites with liquid crystalline polymer (LCP) to endow them with low thermal expansion and toughness. Amine terminated amide type LCP was synthesized as an additive and the effects of LCP on the thermal and mechanical properties of glass fiber/epoxy composites were studied with TMA, DMA and SEM. We believe this materials can be used for chip package substrates and printed circuit boards. |
