화학공학소재연구정보센터
학회 한국공업화학회
학술대회 2006년 봄 (05/12 ~ 05/13, 전북대학교)
권호 10권 1호
발표분야 콜로이드계면화학
제목 액상 PAC을 이용한 FPCB 패터닝 연구
초록 Experiments on micro-patterning of FPCB and RPCB were conducted using the NQD photoresist, a positive-type, and the commercial DFR, a negative-type. A micro-circuit pattern formation on flexible thin copper plate was compared with each other in terms of developing and etching for micro-circuit making. When DFR was used for the formation of micro-lines, the limit of line size for patterning was 50㎛. On the other hands, liquid-type photoresist made from positive type NQD compound was revealed the applicability of more micro-sized patterning, that is, less than 50㎛ through the enhancement of the photosensitivity.
저자 오성상1, 윤세훈2, 이의수2
소속 1신구대, 2동국대
키워드 PAC; FPCB
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