| 초록 |
Epoxy/Phenol resins have been widely used in many engineering areas due to their excellent properties in insulation, adhesion, chemical resistance and moisture absorption. However, they had a relatively high coefficients of thermal expansion(CTE) and this property limited their application areas. In order to improve the CTE of epoxy/phenol resin system, we tried to restrict the segmental chain motion of network structure by introducing a chemical reaction between network chain and nano-silica particles. Therefore, allylated phenol novolac resin(HF-1M) was synthesized and compounded with sulfur containing silane coupling agent(TESPT) treated silica particles(UFP-30), ortho cresol novolac epoxy(EOCN-1022-55) and triphenylphosphine(TPP). Thermo-properties of the cured resin were examined by using DSC, TMA, and TGA, respectively. As a result, we could obtain a new epoxy/phenol resin system with low CTE. |
