| 초록 |
Low dielectric materials have been used as interlayer dielectrics over the years, but the nanoporous ultralow dielectric materials, which have lower dielectric constant and stronger mechanical properties, need to be developed for the next generation semiconductor industries. To develop nanoporous ultralow dielectrics, nano-sized air bubble has to be incorporated into the organosilicate matrix. Therefore, optimization of the mechanical and dielectrical properties is a key issue. We prepared nanoporous dielectric films based on organosilicate matrix and chemically reactive porogens by ozone treatment and obtained the nanoporous ultralow dielectrics with much enhanced mechanical properties. In particular, ozone treatment can convert the methoxy groups of porogens into hydroxyl groups, and result in increased compatibility between the porogen and matrix. We will discuss the effect of ozone treatment on properties and its strengthening mechanism by spectral analysis such as FTIR and Si-NMR. |
