| 초록 |
Delayed development of ultralow dielectrics has forced to modify the ITRS for the dielectrics every year. The main problem with nanoporous ultralow dielectrics is due to their low mechanical properties by the introduction of pores into low-k materials. Therefore, it is main issue to find ways to increase the mechanical properties without sacrifice of dielectric properties. Both UV and ozone treatment (post-treatment) are very effective methods for mechanical enhancement. In addition, UV treatment improved stability of ULK by reduced residual OH group. We prepared nanoporous dielectric films by using organosilicate matrix and chemically reactive porogens. The organosilicate matrix was copolymers of methyl trimethoxysilane (MTMS) and 1,2-bis(triethoxysilyl) ethane (BTESE), and the reactive porogen was trimethoxysilyl xylitol (TMSXT). After ozone and UV treatment respectively, the elastic modulus of ULK greatly increased to 11.2 GPa and 10.8 GPa at 60 vol% porogen loading. |
