| 학회 | 한국화학공학회 |
| 학술대회 | 2006년 가을 (10/27 ~ 10/28, 고려대학교) |
| 권호 | 12권 2호, p.2533 |
| 발표분야 | 재료 |
| 제목 | Metallization on modified polymer for high performance on-chip interconnect |
| 초록 | Polymeric surfaces are notoriously hard to metallize and adhere to since they are relatively inert possessing few surface reactive groups and possess a low surface free energy. To improve polymer metallization and polymer-polymer adhesion a myriad of processes have been developed to functionalize polymeric surfaces. Parylene (polymer) as one of low dielectric constant (low-k) materials is being used as replacements for silicon dioxide for interconnect dielectric applications in high performance silicon integrated circuits. In this work we study the surface reactivity of modified parylene X of films (~200-1300 Å). The surface of the films is investigated with XPS and contact angle goniometry to determine the chemical composition and hydrophobicity of the modified polymer surface. Consequently we investigate the copper electrochemical deposition for metallization on the modified Parylene X sheets. In the study effects of process conditions have been investigated and morphology of the metallized surfaces has been studied by FESEM, XPS, AFM, XRD, and RBS. |
| 저자 | 김영순, 최용석, 김형일, 서형기, 신형식 |
| 소속 | 전북대 |
| 키워드 | Cu; Metallization; Parylene; XPS |
| 원문파일 | 초록 보기 |
