| 학회 |
한국재료학회 |
| 학술대회 |
2015년 가을 (11/25 ~ 11/27, 부산 해운대그랜드호텔) |
| 권호 |
21권 2호 |
| 발표분야 |
B. 나노화학/바이오 재료 |
| 제목 |
Thermally Conductive Aluminum Nitride Thick Films for High Power Electronic Packages |
| 초록 |
With increasing performance requirements for smaller, more capable, and more efficient electronic packages, there has been considerable attention drawn to heat dissipation problem of electronic system. Aluminum nitride (AlN) is regarded as the attractive ceramic materials applicable to the substrate for high power or high current devices, because of its excellent properties in chemical stability and thermal conductivity. In this study, high purity AlN thick film was deposited onto aluminum (Al) substrate using aerosol deposition. Aerosol deposition is a kind of powder spray coating method that can make dense and well-adherent ceramic coating layers at room temperature. The resultant thick AlN film showed highly dense microstructure with no pores, which had never been reported by other groups. In addition, the film exhibited high thermal conductivity and breakdown voltage, indicating that the aerosol-deposited AlN film on Al substrate would be powerfully used as heat sink. |
| 저자 |
박동수, 윤운하, 류정호, 김종우, 안철우, 최종진, 한병동
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| 소속 |
재료(연) |
| 키워드 |
<P>Aluminum Nitride; Thermal conductivity; Thick film; Heat sink</P>
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| E-Mail |
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