| 학회 | 한국공업화학회 |
| 학술대회 | 2018년 가을 (10/31 ~ 11/02, 제주국제컨벤션센터(ICC JEJU)) |
| 권호 | 22권 2호 |
| 발표분야 | 접착제.도료.잉크_포스터 |
| 제목 | DEVELOPMENT AND PERFORMANCE EVALUATION OF PHOTO IMAGEABLE SOLDER RESIST OPTIMIZED VIA DESIGN OF HALOGEN AND TGIC-FREE COMPOSITION FOR AUTOMOTIVE APPLICATION |
| 초록 | Higher reliability and durability at the environmental condition of high temperature and humidity are required to use the automotive electronic devices as an engine control unit (ECU). Normally, the conventional photoimageable solder resist shows defects such as decreases of insulation resistance and adhesiveness, crack or thermal degradation of cured matrix at the harsh environment test condition. For this reason, we have developed the automotive applicable triglycidylisocyanurate-free photoimageable solder resist with high reliability and thermal durability. We have also confirmed automotive applicable reliability, high heat conductivity, low dielectric constant and dissipation factor under various test conditions such as acceleration of temperature humidity bias, thermal cycle test, immersion tin, electroless nickel immersion gold and hot air solder levelling. |
| 저자 | 김재호, 이진희, 전성제 |
| 소속 | 한국다이요잉크 |
| 키워드 | Photoimageable; Solder Resist; Automotive; Reliability; TGIC-Free |
