| 초록 |
Polyimides have found many applications as high temperature insulators and dielectrics, adhesives and matrices for high performance composites due to their excellent electrical, thermal, and high temperature mechanical properties. And efforts were directed towards the synthesis and characterization of polyisoimides in order to develop novel soluble precursor of polyimides. The feature that polyisoimides possesses improved solubility and can be converted to polyimides without formation of water (or other volatile byproduct) could be advantageously utilized in fabrication of void-free laminates and adhesive joints. Also polymer/inorganic nanocomposites have recently received considerable attention, because they often exhibit superior physical, mechanical and thermal properties to conventional composites or unfilled polymers. Lately, there was a considerable amount of publications associated with the preparation and properties of polyimide-clay nanocomposite. Usually rigid and aromatic polyimides are insoluble and show limited processability, so that soluble poly(amic acid) precursors are frequently used for solution dispersion or in-situ polymerization method is employed sometimes. In this work, organo-soluble polyisoimide typically from ODPA/ODA was synthesized and used for the preparation of nanocomposites with commercial MMTs. By thermal curing process, the polyisoimide-clay is converted into polyimide-clay nanocomposite film. The intercalation behavior and thermal and mechanical properties of the composites in cast films were investigated. |
