| 초록 |
A dielectric polyimide(PI)-silica hybrid films was prepared by a sol-gel process from tetraethyl orthosilicate (TEOS). For obtaining homogeneous dispersion and low dielectric properties with the polyimide matrix, 1,4-cyclohexanedicarboxylic acid (1,4-CHDA) with alicyclic moiety was added as a coupling agents. Hydrogen bonding was formed by a carboxyl group of 1,4-CHDA at the –OH of TEOS and carboxyl group of polyamic acid(PAA), respectively. As a result, silica particles were dispersed homogenously in the PI matrix. The polyimide-silica hybrid films were characterized by Fourier transform infrared spectroscopy (FT-IR), scanning electron microscope (SEM), differential scanning calorimeter (DSC) and thermogravimetric analysis (TGA). The mechanical and dielectric properties of the films were measured. The results demonstrate that the optical and dielectric properties of the films were adjusted by varying the silica and 1,4-CHDA concentration in the PI matrix. |
